Semiconductor Fab Expansion β Wuxi
Project Scope
Design and installation of an 8,500 mΒ² semiconductor cleanroom addition for a major chip manufacturer. The facility features Class 10 (ISO 4) lithography bays and Class 100 (ISO 5) general fab areas with stringent vibration, ESD, and AMC controls.
Highlights
- Micro-vibration isolation: VC-D rating in lithography bays
- Full raised-floor return-air plenum with perforated panels
- Chemical filtration for airborne molecular contamination (AMC)
- 100% ULPA ceiling coverage in ISO 4 zones
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